Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn-Ag-Cu-Ce soldered joints

Soldering & Surface Mount Technology

Volumn 23, Issue 1, 2011, Pages 4-9

  Zhang, Liang ^a   Xue, Song Bai ^a   Gao, Li Li ^a   Sheng, Zhong ^a   Dai, Wei ^a   Ji, Feng ^a   Ye, Huan ^a   Chen, Yan ^b   Yu, Sheng Lin ^a,c  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HARBIN WELDING INSTITUTE   (China)

^c CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

Chemical elements and inorganic compounds; Copper; Finite element simulation; Joining processes; Silver; Soldering; Stress (materials)

Indexed keywords

ALLOYING ADDITIONS; CREEP STRENGTHS; DESIGN/METHODOLOGY/APPROACH; FINITE ELEMENT SIMULATIONS; FORMATION MECHANISM; GROWTH MECHANISMS; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUNDS; JOINING PROCESSES; LEAD FREE SOLDERS; LEAD-FREE SOLDERED JOINTS; OSTWALD RIPENING THEORY; RELIABILITY INVESTIGATIONS; SN-AG-CU; SNAGCU SOLDER; STRESS (MATERIALS); STRESS DISTRIBUTION; TRACE AMOUNTS; VON MISES STRESS;

CERIUM; CHEMICAL ELEMENTS; CHEMICALS; FRACTURE; INORGANIC COMPOUNDS; INTERMETALLICS; JOINING; OSTWALD RIPENING; RELIABILITY THEORY; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; STRESS CONCENTRATION; TENSILE STRENGTH; TIN ALLOYS;

TIN;

EID: 79551476404     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911111099640     Document Type: Article

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