Development of thermodynamic and kinetic databases in micro-soldering alloy systems and their applications

Progress in Natural Science: Materials International

Volumn 21, Issue 2, 2011, Pages 97-110

  Liu, Xing Jun ^a   Wang, Cui Ping ^a   Ohnuma, Ikuo ^b   Kainuma, Ryosuke ^b   Ishida, Kiyohito ^b  

^a XIAMEN UNIVERSITY   (China)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Kinetics; Micro soldering alloys; Thermodynamics

Indexed keywords

COMPUTER SOFTWARE; DATABASE SYSTEMS; LEAD-FREE SOLDERS; MICROSTRUCTURE; PHASE EQUILIBRIA; SOLDERING; SUBSTRATES; THERMODYNAMICS;

ALLOY SYSTEM; DICTRA SOFTWARE; KINETIC DATABASE; MICRO-SOLDERING ALLOY; MULTI-COMPONENT PHASIS; RECENT PROGRESS; SOFTWARE PROJECT; THERMOCALC SOFTWARE; THERMODYNAMIC DATABASE; THERMODYNAMICS AND KINETICS;

KINETICS;

EID: 84861992624     PISSN: 10020071     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1002-0071(12)60042-2     Document Type: Article

References (34)

1. Manko H H. Solder and soldering [M]. 2nd Ed. New York: McGraw-Hill, 1979.
2. Abtew M, Selvaduray G. Lead-free solders in microelectronics [J]. Mater Sci Eng R, 2000, 27: 95-141.
3. Vianco T P. Development of alternatives to lead-bearing solders [C]// Proceedings of the Technical Program on Surface Mount International. 1993.
4. Reed-hill R E. Physical metallurgy principles [M]. Massachusetts: PWS Publishing Company, 1994.
5. Napp D. Lead-free interconnect materials for the electronics industry [C]// Proceedings of the 27th International SAMPL Technical Conference. Albuquerque, NM, 1995.
6. Biocca P. Global update on lead-free solders [J]. Surf Mount Technol, 1999, 13(6): 64-67.
7. Kang S K, Sarkhel A K. Lead (Pb)-free solders for electronic packaging [J]. J Electron Mater, 1994, 23: 701-707.
8. Vianco P T, Frear D R. Issues in the replacement of lead-bearing solders [J]. JOM, 1993, 45: 14-18.
9. Sundman B, Jansson B, Anderson T O. The Thermo-Calc databank system [J]. CALPHAD, 1985, 9: 153-190.
10. Saunders N, Miodownik A P. Calphad (calculation of phase diagrams)-A comprehensive guide [M]. Oxford: Pergamon Press, 1998.
11. Lukas H, Fries S G, Sundman B. Computational thermodynamics- The CALPHAD method [M]. Cambridge: Cambridge University Press, 2007.
12. Ohnuma I, Liu X J, Ohtani H, et al. Thermodynamic database for phase diagrams in micro-soldering alloys [J]. J Electron Mater, 1999, 28: 1164-1171.
13. Ohnuma I, LIU X J, Ohtani H, et al. Functional materials [M]. GRASSIE K, TENCKHOFF E, WEGNER G, et al, eds. Weinheim: Wiley-VCH, 2000: 69-74.
14. Liu X J, Chen S L, Ohnuma I, et al. Mechanics and materials engineering for science and experiments [M]. ZHOU Y C, GU Y X, LI Z, eds. New York: Science Press, 2001: 334-337.
15. Liu X J, Ohnuma I, Wang C P, et al. Thermodynamic database on microsolders and copper-based alloy systems [J]. J Electron Mater, 2003, 32: 1265-1272.
16. Wang C P, Liu X J, Jiang M, et al. Thermodynamic database of the phase diagrams in copper base alloy systems [J]. J Phys Chem Solids, 2005, 66: 256-260.
17. Liu X J, Oikawa K, Ohnuma I, et al. The use of phase diagrams and thermodynamic databases for electronic materials [J]. JOM, 2003, 55: 53-59.
18. Tu K N, Zeng K. Tin-lead (SnPb) solder reaction in flip chip technology [J]. Mater Sci Eng R, 2001, 34: 1-58.
19. Cui Y W, Jiang M, Ohnuma I, et al. Computational study of atomic mobility for FCC phase of Co-Fe and Co-Ni binaries [J]. J Phase Equilibria and Diffusion, 2008, 29: 2-10.
20. Cui Y W, Jiang M, Ohnuma I, et al. Computational study of atomic mobility in Co-Fe-Ni ternary FCC alloys [J]. J Phase Equilibria and Diffusion, 2008, 29: 312-321.
21. Liu X J, Shangguan N, Wang C P. Assessment of the diffusional mobilities in the face-centred cubic Ag-Zn alloys [J]. CALPHAD, 2011, 35: 155-159.
22. Annika B, Anders E, Lars H, et al. Dictra, a tool for simulation of diffusional transformations in alloys [J]. J Phase Equilibria, 2000, 21: 269-280.
23. Dinsdale A T. SGTE data for pure elements [J]. CALPHAD, 1991, 15: 317-425.
24. Redlich O, Kister A T. Thermodynamics of nonelectrolyte solutions-x-y-t relations in a binary system [J]. Ind Eng Chem, 1948, 40: 341-345.
25. Hillert M, Stafansson L I. The regular solution model for stoichiometric phases and ionic metals [J]. Acta Chem Scand, 1970, 24: 3618-3626.
26. Bulter J A V. The thermodynamics of the surfaces of solutions [J]. Proc Roy Soc, 1932, 135: 348-375.
27. Yeum K S, Speiser R, Poirier D R. Estimation of the surface tensions of binary liquid alloys [J]. Metall Trans B, 1989, 20: 693-703.
28. Tanaka T, Lida I. Application of a thermodynamic database to the calculation of surface tension for iron-base liquid alloys [J]. Steel Research, 1994, 65: 21-28.
29. Seetharaman S, Sichen D. Estimation of the viscosities of binary metallic melts using Gibbs energies of mixing [J]. Metall Mater Trans, 1994, 25: 589-595.
30. Andersson J O, Agren J. Models for numerical treatment of multicomponent diffusion in simple phases [J]. J Appl Phys, 1992, 72: 1350-1-6.
31. Wang J, Liu H S, Liu L B, et al. Assessment of diffusion mobilities in FCC Cu-Ni alloys [J]. Computer Coupling of Phase Diagrams and Thermochemistry, 2008, 32: 94-100.
32. Darken L S. Diffusion, mobility and their interrelation through free energy in binary metallic systems [J]. Trans AIME, 1948, 175: 184-201.
33. Chen S L, Daniel S, Zhang F, et al. The PANDAT software package and its applications [J]. CALPHAD, 2002, 26: 175-188.
34. Hao S, Anzai K, Niyama E. Numerical simulation of fluid flow as applied to casting design [J] . Trans AFS, 1995, 103: 41-46.