Wettability and interfacial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints

Journal of Alloys and Compounds

Volumn 486, Issue 1-2, 2009, Pages 142-147

  Yoon, Jeong Won ^a   Noh, Bo In ^a   Kim, Bong Kyun ^b   Shur, Chang Chae ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Interfacial reaction; Intermetallic compound; Sn Ag Cu solder; Sn Ag Ni solder; Wetting test

Indexed keywords

INTERFACIAL REACTION; INTERMETALLIC COMPOUND; SN-AG-CU SOLDER; SN-AG-NI SOLDER; WETTING TEST;

ADDITION REACTIONS; NICKEL; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; WETTING;

TIN;

EID: 70350237049     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.06.159     Document Type: Article

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