Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development

Microelectronic Engineering

Volumn 85, Issue 7, 2008, Pages 1577-1583

  Lee, Jung Sub ^a   Chu, Kun Mo ^a   Patzelt, Rainer ^b   Manessis, Dionysios ^b   Ostmann, Andreas ^b   Jeon, Duk Young ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Co addition; Composite solder; Sn 3.5Ag

Indexed keywords

ADDITION REACTIONS; BRAZING; COBALT; COBALT ALLOYS; COBALT COMPOUNDS; EUTECTICS; KETONES; MELTING; MELTING POINT; METAL MELTING; MIXTURES; SHEAR STRENGTH; SHEARING MACHINES; SILVER; STRENGTH OF MATERIALS; TESTING; TIN; TIN ALLOYS; WELDING;

BALL SHEAR TEST; CO ADDITION; CO PARTICLES; COMPOSITE SOLDERS; MAXIMUM SHEAR (MS); MELTING TEMPERATURE (TM); MICROSTRUCTURAL DEVELOPMENTS; SOLDER BUMPING; SOLDER PASTES; STRENGTH (IGC: D5/D6); TEST SUBSTRATES; UNDER HEATING; WEIGHT FRACTIONS;

METALS;

EID: 45249119273     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.03.002     Document Type: Article

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