Effect of Zn on properties and microstructure of SnAgCu alloy

Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 11, 2012, Pages 1950-1956

  Zhang, Liang ^a,b   Han, Ji Guang ^a   He, Cheng Wen ^a   Guo, Yong Huan ^a  

^a JIANGSU NORMAL UNIVERSITY   (China)

^b JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CU-SN INTERMETALLICS; EFFECTIVE RANGE; LEAD FREE SOLDERS; PROPERTIES AND MICROSTRUCTURES; SNAGCU ALLOYS; SNAGCU SOLDER; ZN CONTENT;

CERIUM ALLOYS; MECHANICAL PROPERTIES; MICROSTRUCTURE; SOLDERING ALLOYS; TIN; WETTING;

ZINC;

EID: 84869506526     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-012-0686-9     Document Type: Article

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