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Volumn 558, Issue , 2012, Pages 253-258

Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation

Author keywords

Creep; Elastic modulus; Hardness; Nanoindentation; SnBi; Stress exponent

Indexed keywords

BINARY ALLOYS; CREEP; CREEP RESISTANCE; ELASTIC MODULI; HARDNESS; LAMELLAR STRUCTURES; NANOINDENTATION; STRAIN RATE;

EID: 84866277698     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2012.07.120     Document Type: Article
Times cited : (143)

References (20)
  • 2
    • 0027876247 scopus 로고
    • Proceedings of the IEEE/CHMT International Electronics Manufacturing Technology Symposium
    • C.H. Raeder, L.E. Felton, D.B. Knorr, G.D. Schmeelk, D. Lee, Proceedings of the IEEE/CHMT International Electronics Manufacturing Technology Symposium, 1993, pp. 119-127.
    • (1993) , pp. 119-127
    • Raeder, C.H.1    Felton, L.E.2    Knorr, D.B.3    Schmeelk, G.D.4    Lee, D.5
  • 19
    • 85163339350 scopus 로고    scopus 로고
    • Web Source From NIST Phase Diagrams Research
    • Web Source From NIST Phase Diagrams Research, http://www.metallurgy.nist.gov/phase/solder/bisn.html.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.