Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate

Soldering and Surface Mount Technology

Volumn 25, Issue 2, 2013, Pages 91-98

  Chan, Y H ^a   Arafat, M M ^a   Haseeb, A S M A ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

Copper; Flow; Intermetallic compounds; Nanocomposite solder; Reflow; Solder; Zn nanoparticles

Indexed keywords

ENERGY DISPERSIVE X RAY SPECTROSCOPY; FIELD EMISSION SCANNING ELECTRON MICROSCOPES; FLOW; INDUCTIVELY COUPLED PLASMA-OPTICAL EMISSION SPECTROSCOPY; JAPANESE INDUSTRIAL STANDARDS; NANOCOMPOSITE SOLDER; REFLOW; ZN NANOPARTICLES;

CONTACT ANGLE; COPPER; COPPER COMPOUNDS; EMISSION SPECTROSCOPY; INDUCTIVELY COUPLED PLASMA; INTERMETALLICS; NANOCOMPOSITES; NANOPARTICLES; SILVER; SOLDERING ALLOYS; X RAY SPECTROSCOPY; ZINC;

TIN;

EID: 84875949447     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911311309040     Document Type: Article

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