Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 6, 2010, Pages 635-642

  Zhang, Liang ^a   Xue, Song Bai ^a   Gao, Li Li ^a   Sheng, Zhong ^a   Zeng, Guang ^a   Chen, Yan ^b   Yu, Sheng Lin ^a,c  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HARBIN WELDING INSTITUTE   (China)

^c CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ARRHENIUS MODELS; CREEP DISTRIBUTION; CREEP STRAIN; CRITICAL ISSUES; ELECTRONIC PACKAGING; INFRARED REFLOWS; INTERMETALLIC COMPOUND LAYER; LEAD FREE SOLDERS; LEAD-FREE SOLDERED JOINTS; QUAD FLAT PACKAGE; QUAD FLAT PACKAGING; SIMULATED RESULTS; SN-AG-CU; SNAGCU SOLDER; STRESS-STRAIN RESPONSE;

CERIUM; CERIUM COMPOUNDS; CREEP; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERMETALLICS; LEAD; MECHANICAL PROPERTIES; PACKAGING; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; TENSILE STRENGTH; TIN ALLOYS;

TIN;

EID: 77955585278     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9969-1     Document Type: Article

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