Effect of Fe particles on microstructures and properties of Sn-3Ag-0.5Cu lead-free solder

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 22, Issue 4, 2012, Pages 1169-1176

  Liu, Xiao Ying ^a   Ma, Hai Tao ^a   Luo, Zhong Bing ^a   Zhao, Yan Hui ^a   Huang, Ming Liang ^a   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Composite lead free solder; Shear strength; Sn 3Ag 0.5Cu; Viscosity; Wettability

Indexed keywords

CONTACT AREAS; FRICTION FORCE; INCREASING VISCOSITY; LEAD FREE SOLDERS; MICROSTRUCTURES AND PROPERTIES; SN-3AG-0.5CU; SOLDER ALLOYS; SOLDER BALLS; SOLDER PASTE;

IRON ALLOYS; MECHANICAL PROPERTIES; MICROSTRUCTURE; SHEAR STRENGTH; SILVER; SILVER ALLOYS; VISCOSITY; WETTING;

TIN;

EID: 84862334490     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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