Effects of nano-particles on properties of electronic solders

Applied Mechanics and Materials

Volumn 236-237, Issue , 2012, Pages 31-37

  Du, Changhua ^a   Tang, Ming ^a   Gan, Guisheng ^a   Wang, Tao ^a   Huang, Wenchao ^a   Cao, Mingming ^a   Li, Chuntian ^a  

^a CHONGQING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Composite solders; Mechanisms; Nano particles; Performance

Indexed keywords

BRAZING PROCESS; COMPOSITE SOLDERS; CRYSTAL LATTICE STRUCTURE; DISSOLUTION RATES; ELECTRONIC SOLDERS; FRAME STRUCTURE; GRAIN BOUNDARY STRENGTHENING; HIGH ENERGY; LIQUID SOLDERS; LOW-ENERGY STATE; PERFORMANCE; PHASE II; STRENGTHENING MECHANISMS; WET ABILITY;

ADSORPTION; DISSOLUTION; GRAIN BOUNDARIES; GROWTH (MATERIALS); INFORMATION TECHNOLOGY; LIQUIDS; MANUFACTURE; MECHANISMS; MELTING POINT; SOLDERING ALLOYS; STRENGTH OF MATERIALS;

NANOPARTICLES;

EID: 84871567020     PISSN: 16609336     EISSN: 16627482     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMM.236-237.31     Document Type: Conference Paper

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