Understanding the influence of copper nanoparticles on thermal characteristics and microstructural development of a tin-silver solder

Journal of Materials Engineering and Performance

Volumn 16, Issue 5, 2007, Pages 647-654

  Lin, D C ^a   Srivatsan, T S ^b   Wang, G X ^b   Kovacevic, R ^a  

^a Research Center for Advanced Manufacturing   (United States)

^b University of Akron   (United States)

Author keywords

Lead free solder; Nanoparticles; Sn 3.5 Ag; Solidification; Temperature recording

Indexed keywords

LEAD FREE SOLDERS; RESIDUAL POROSITY; TEMPERATURE RECORDING;

COPPER; MICROSTRUCTURAL EVOLUTION; SILVER; SOLDERING ALLOYS; SOLIDIFICATION; THERMODYNAMIC PROPERTIES; TIN;

NANOPARTICLES;

EID: 34548543074     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-007-9092-5     Document Type: Article

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