|
Volumn 7, Issue 11, 2005, Pages 1049-1054
|
High strength lead-free composite solder materials using Nano-Al 2O3 as reinforcement
|
Author keywords
[No Author keywords available]
|
Indexed keywords
ALUMINA;
COMPOSITE MATERIALS;
LEAD;
POWDER METALLURGY;
REINFORCEMENT;
SYNTHESIS (CHEMICAL);
LEAD FREE SOLDER;
LEAD-FREE COMPOSITE;
NANO SIZE ALUMINA PARTICLES;
SECONDARY PHASES;
SOLDERING;
|
EID: 29444447149
PISSN: 14381656
EISSN: None
Source Type: Journal
DOI: 10.1002/adem.200500109 Document Type: Article |
Times cited : (63)
|
References (26)
|