Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

Journal of Applied Physics

Volumn 97, Issue 6, 2005, Pages

  Gan, H ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

METAL FILMS; POLARITY EFFECTS; THERMAL ANNEALING; V-GROOVE;

ANODES; CURRENT DENSITY; ELECTRIC CURRENTS; ELECTRODES; ELECTROMIGRATION; LEAD; MASS TRANSFER; MATHEMATICAL MODELS; OXIDATION; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS;

INTERMETALLICS;

EID: 20444462371     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1861151     Document Type: Article

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