Reliability of lead-free solder joints in CSP device under thermal cycling

Journal of Materials Science: Materials in Electronics

Volumn 25, Issue 3, 2014, Pages 1209-1213

  Zhang, Liang ^a,b   Sun, Lei ^a   Guo, Yong Huan ^a   He, Cheng Wen ^a  

^a JIANGSU NORMAL UNIVERSITY   (China)

^b Engineering IV   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84894654049     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-014-1711-y     Document Type: Article

References (13)

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