Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

Microelectronics Reliability

Volumn 49, Issue 3, 2009, Pages 248-252

  Wang, Y W ^a   Lin, Y W ^a   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; BRAZING; ELECTROCHEMISTRY; ELECTROPLATING; LEAD; NICKEL; SILVER; SOLDERING ALLOYS; TIN; WELDING;

CU SUBSTRATES; HIGH PURITIES; IMPURITIES IN; KIRKENDALL VOIDS; LEAD-FREE SOLDERS; NI-DOPED; REACTION CONDITIONS; REACTION PRODUCTS;

SUBSTRATES;

EID: 60849105954     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.09.010     Document Type: Article

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