Electromigration in ULSI interconnects

Materials Science and Engineering R: Reports

Volumn 58, Issue 1-2, 2007, Pages 1-75

  Tan, Cher Ming ^a   Roy, Arijit ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Aluminum; Copper; Driving force; Electromigration; Reliability data analysis; Test structure

Indexed keywords

ALUMINUM COMPOUNDS; COPPER COMPOUNDS; DATA REDUCTION; ELECTROMIGRATION; ELECTRONS; MICROMETERS; STATISTICAL METHODS;

DRIVING FORCE; ELECTRON WIND FORCE; RELIABILITY DATA ANALYSIS; TEST STRUCTURE;

ULSI CIRCUITS;

EID: 34648819822     PISSN: 0927796X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mser.2007.04.002     Document Type: Review

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