Development of highly accelerated electromigration test

Microelectronics Reliability

Volumn 46, Issue 9-11, 2006, Pages 1638-1642

  Tan, Cher Ming ^a   Li, Wei ^a   Tan, Kok Tong ^b   Low, Frankie ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SYSTEMS ON SILICON MANUFACTURING CO PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; FINITE ELEMENT METHOD; PHYSICAL PROPERTIES; STATISTICAL METHODS; TRANSMISSION ELECTRON MICROSCOPY;

ELECTROMIGRATION (EM); ELECTROMIGRATION TESTS; PHYSICAL MECHANISM;

ELECTROMIGRATION;

EID: 33748069470     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.034     Document Type: Article

References (12)

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