SCOPUS 정보 검색 플랫폼

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 39, Issue 3 A, 2000, Pages 994-998

Early increase in resistance during electromigration in AlCu-plugged via structures

(1) Hoshino, Kazuhiro a

a SONY CORPORATION (Japan)

Author keywords

Al plug; Electromigration; Failure mechanism; Interconnect; Metallization; OBIRCH; Voiding, AlCu

Indexed keywords

ANODES; COPPER COMPOUNDS; CRYSTALLIZATION; CURRENT DENSITY; ELECTRIC RESISTANCE; HELIUM NEON LASERS; IMAGE PROCESSING; LASER BEAMS; THERMAL CONDUCTIVITY; TRANSMISSION ELECTRON MICROSCOPY;

ALUMINUM PLUG; OPTICAL BEAM INDUCED RESISTANCE CHANGE; VOIDING;

ELECTROMIGRATION;

EID: 0033750952 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.39.994 Document Type: Article

Times cited : (3)

References (11)

1
- 0028737559
- G. A. Dixit, M. F. Chisholm, M. K. Jain, T. Weaver, L. M. Ting, S. P. Oarch, K. Mizobuchi, R. H. Havemann, C. D. Dobsion, A. I. Jeffryes, P. J. Haverson, P. Rich, D. C. Butler and J. Hems: Tech. Dig. Int. Electron Devices Meet., 1994, p. 105.
- (1994) Tech. Dig. Int. Electron Devices Meet. , pp. 105
- Dixit, G.A.¹ Chisholm, M.F.² Jain, M.K.³ Weaver, T.⁴ Ting, L.M.⁵ Oarch, S.P.⁶ Mizobuchi, K.⁷ Havemann, R.H.⁸ Dobsion, C.D.⁹ Jeffryes, A.I.¹⁰ Haverson, P.J.¹¹ Rich, P.¹² Butler, D.C.¹³ Hems, J.¹⁴

2
- 85056495175
- C. S. Park, S. I. Lee, J. H. Park, J. H. Sohn, D. Chin and J. G. Lee: Proc. 8th Int. VLSI Multilevel Conf., 1991, p. 326.
- (1991) Proc. 8th Int. VLSI Multilevel Conf. , pp. 326
- Park, C.S.¹ Lee, S.I.² Park, J.H.³ Sohn, J.H.⁴ Chin, D.⁵ Lee, J.G.⁶

3
- 19644393487
- H. Kawasaki, C. Lee and F. Pintchovski: 187th Electrochemical Society Proc., 1995, Vol. 95-3, p. 165.
- (1995) 187th Electrochemical Society Proc. , vol.95 , Issue.3 , pp. 165
- Kawasaki, H.¹ Lee, C.² Pintchovski, F.³

4
- 0345222459
- M. Fujii, K. Koyama and J. Aoyama: Proc. 13th VLSI Multilevel Interconnection Conf., 1996, p. 312.
- (1996) Proc. 13th VLSI Multilevel Interconnection Conf. , pp. 312
- Fujii, M.¹ Koyama, K.² Aoyama, J.³

5
- 0029698674
- H. Kawasaki and C. K. Hu: Proc. Int. Symp. VLSI Technology, 1996, p. 192.
- (1996) Proc. Int. Symp. VLSI Technology , pp. 192
- Kawasaki, H.¹ Hu, C.K.²

6
- 19644374562
- K. Hoshino and M. Takizawa: Proc. 13th VLSI Multilevel Interconnection Conf., 1996, p. 283.
- (1996) Proc. 13th VLSI Multilevel Interconnection Conf. , pp. 283
- Hoshino, K.¹ Takizawa, M.²

7
- 19644400309
- K. Hoshino: Proc. Int. Symp. Interconnect and Contact Metallization, 1998, Vol. 97-31, p. 203.
- (1998) Proc. Int. Symp. Interconnect and Contact Metallization , vol.97 , Issue.31 , pp. 203
- Hoshino, K.¹

8
- 0042279334
- K. Nikawa and S. Tozaki: Proc. Int. Symp. Testing and Failure Analysis, 1993, p. 303.
- (1993) Proc. Int. Symp. Testing and Failure Analysis , pp. 303
- Nikawa, K.¹ Tozaki, S.²

9
- 19644390455
- [in Japanese]
- K. Nikawa, C. Matsumoto and S. Inoue: Ninon Gakujutsu Shinko Tech. Note 132-125, 1993, p. 13 [in Japanese].
- (1993) Ninon Gakujutsu Shinko Tech. Note , vol.132 , Issue.125 , pp. 13
- Nikawa, K.¹ Matsumoto, C.² Inoue, S.³

10
- 33645044266
- Joint Committee Powder Diffraction Standard (JCPDS) cards, Number 25-12
- Joint Committee Powder Diffraction Standard (JCPDS) cards, Number 25-12.

11
- 0030719744
- D. Jawarani, M. Gall, R. Hermandez, C. Capasso and H. Kawasaki: Proc. Int. Symp. VLSI Technology, 1997, p. 39.
- (1997) Proc. Int. Symp. VLSI Technology , pp. 39
- Jawarani, D.¹ Gall, M.² Hermandez, R.³ Capasso, C.⁴ Kawasaki, H.⁵

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.