Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling

Journal of Applied Physics

Volumn 101, Issue 10, 2007, Pages

  Li, Wei ^a   Tan, Cher Ming ^a   Hou, Yuejin ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROMIGRATION; FINITE ELEMENT METHOD; MONTE CARLO METHODS; NUCLEATION; THIN FILMS;

ATOMIC MIGRATION; THERMOMECHANICAL STRESS; VOID GROWTH; VOID NUCLEATION;

POLYCRYSTALLINE MATERIALS;

EID: 34249887657     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2723869     Document Type: Article

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