Additional effect of texture on the electromigration behavior of aluminum

Microelectronic Engineering

Volumn 55, Issue 1-4, 2001, Pages 337-340

  Dorgelo, A M ^a   Vroemen, J A M W ^b   Wolters, R A M ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL ORIENTATION; ELECTROMIGRATION; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTOR GROWTH; TEXTURES; X RAY DIFFRACTION ANALYSIS;

MEAN TIME TO FAILURE (MTF);

SEMICONDUCTING FILMS;

EID: 0034818692     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00465-2     Document Type: Article

References (2)

1. S. Vadya, A.K. Sinha, Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films, Thin Solid Films 75 (1981) 253-259.
2. H.P. Klug, L.E. Alexander, in: X-Ray Diffraction Procedures, 2nd Edition, Wiley, New York, London, 1974.