Investigating the microstructure-reliability relationship in Cu damascene lines

Scripta Materialia

Volumn 45, Issue 9, 2001, Pages 1069-1075

  Field, David P ^a   Dornisch, Dieter ^b   Tong, Huayu H ^b  

^a Washington State University   (United States)

^b Rockwell Semiconductor Systems   (United States)

Author keywords

Copper; Electromigration; Electron diffraction; Microstructure

Indexed keywords

COPPER; CRYSTALLOGRAPHY; ELECTROMIGRATION; ELECTRON DIFFRACTION; ELECTROPLATING; GRAIN GROWTH; GRAIN SIZE AND SHAPE; METALLIC FILMS; RECRYSTALLIZATION (METALLURGY); TEXTURES;

COPPER DAMASCENE LINES;

CRYSTAL MICROSTRUCTURE;

EID: 0035823886     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(01)01141-1     Document Type: Article

References (8)