SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 859-864

Thermal stress and debonding in CU/low k damascene line structures

(4) Du, Yong a Wang, Guotao b Merrill, Caroline b Ho, Paul S b

a PRC/MER ^* (United States)

b UNIVERSITY OF TEXAS AT AUSTIN (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CALCULATIONS; COMPUTER SIMULATION; COPPER; DEBONDING; DEFORMATION; DEGREES OF FREEDOM (MECHANICS); DELAMINATION; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD;

DAMASCENCE;

THERMAL STRESS;

EID: 0036287649 PISSN: 05695503 EISSN: None Source Type: Journal
DOI: 10.1109/ECTC.2002.1008201 Document Type: Article

Times cited : (29)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.