Reservoir modeling for electromigration improvement of metal systems with refractory barriers

IEEE International Reliability Physics Symposium Proceedings

Volumn 2001-January, Issue , 2001, Pages 327-333

  Dion, M J ^a  

^a INTERSIL CORPORATION   (United States)

Author keywords

Artificial intelligence; Conductors; Copper; Current density; Electromigration; Electronics industry; Electrons; Life testing; Reservoirs; Tin

Indexed keywords

ARTIFICIAL INTELLIGENCE; COPPER; CURRENT DENSITY; ELECTRIC CONDUCTORS; ELECTRONICS INDUSTRY; ELECTRONS; METAL IONS; METALS; PETROLEUM RESERVOIRS; REFRACTORY METALS; TIN; TUNGSTEN;

BARRIER METALS; LIFE-TESTING; METAL SYSTEMS; RESERVOIR LENGTH; RESERVOIR MODELING;

ELECTROMIGRATION;

EID: 0041967471     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2001.922923     Document Type: Conference Paper

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