Identification of electromigration dominant diffusion path for Cu damascene interconnects and effect of plasma treatment and barrier dielectrics on electromigration performance

IEEE International Reliability Physics Symposium Proceedings

Volumn 2004-January, Issue January, 2004, Pages 246-250

  Usui, T ^a   Oki, T ^a   Miyajima, H ^a   Tabuchi, K ^b   Watanabe, K ^b   Hasegawa, T ^b   Shibata, H ^a  

^a TOSHIBA CORPORATION   (Japan)

^b SONY CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ANALYSIS; ACTIVATION ENERGY; DIELECTRIC MATERIALS; DIFFUSION; ELECTROMIGRATION; FAILURE ANALYSIS; INTEGRATED CIRCUIT INTERCONNECTS; PLASMA APPLICATIONS;

BARRIER DIELECTRICS; CU DAMASCENE INTERCONNECTS; CU DIFFUSION; DAMASCENE INTERCONNECTS; DIFFUSION PATHS; ELECTROMIGRATION TESTING; PLASMA TREATMENT; TESTING PATTERN;

DIFFUSION BARRIERS;

EID: 84903855817     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2004.1315331     Document Type: Conference Paper

References (9)

1. J. Tao, N.W. Cheung and C. Hu, "Modeling Electromigration Tailures in TiN/AI-aftoy/TiN Interconnects and TiN Thin Film" in Troceeding of 33 annual International Reliability Physics Tymposium, 1995
2. C.K. Hu et al., "Scaling Effect on Electromigration in On chip Tu wiring" in IEEE International Interconnects Technology Tonference, 1999, p. 267.
3. M. Hatano et a!., "EM lifetime improvement of Cu damascene Tnterconnects by P-SiC cap layer", in IEEE International Tnterconnect Technology Conference, 2002, p. 212
4. C.K.. Hu et at., "Reduced electromigration of Cu wires by Turface coating", Appl. Phys. Lett., 81, p. 1782,2002
5. M.W. Lane, E, Gt Liniger and J. R-Lloyd, "Relationship Tetween interfacial adhesion and electromigration in Cu Tetallization", J. Appl. Phys., 93, p. 1417,2003
6. C.K. Hu et a!., "Comparison of Cu electromigration lifetime in Tu interconnects coated with various caps", Appl. Phys. Lett., 83, T. 869,2003
7. C.K. Hu, R. Rosenberg and K.Y. Lee, "Electromigration path Tn Cu thin-film lines", Appl. Phys. Lett., 74, p. 2945,1999
8. S. Yokogawa and H. Takizawa, "Electromigration Induced Tncubation, Drift and Threshold in Single-Damascene Copper Tnterconnects", in IEEE International Interconnect Technology Tonference, 2001, p. 127
9. K. Kaji etal,J. Electron Microscopy. 50, 15 (2001)