Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure

Thin Solid Films

Volumn 515, Issue 7-8, 2007, Pages 3867-3874

  Roy, Arijit ^a   Tan, Cher Ming ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Copper; Driving forces; Electromigration; Finite element analysis

Indexed keywords

CORRELATION METHODS; CURRENT DENSITY; ELECTRIC POWER SYSTEM INTERCONNECTION; FINITE ELEMENT METHOD; STRESS ANALYSIS;

ATOMIC FLUX DIVERGENCE; COPPER INTERCONNECTS; CURRENT FLOW DIRECTION; STRESS FIELDS;

ELECTROMIGRATION;

EID: 33846994074     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.10.124     Document Type: Article

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