Effect of low dielectric polymer thickness on the electromigration characteristics of Al(1% Cu-0.5% Si) thin films

Thin Solid Films

Volumn 382, Issue 1-2, 2001, Pages 222-229

  Yoo, Sehoon ^a   Eun, Byung Soo ^a   Kim, Young Ho ^a   Chung, Yong Chae ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; CHEMICAL VAPOR DEPOSITION; ELECTROMIGRATION; PLASTIC FILMS; POLYIMIDES; THIN FILMS;

JOULE HEATING;

DIELECTRIC FILMS;

EID: 0034831643     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)01773-9     Document Type: Article

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