Effect of electron flow direction on model parameters of electromigration-induced failure of copper interconnects

Journal of Applied Physics

Volumn 94, Issue 10, 2003, Pages 6463-6467

  Padhi, Deenesh ^a   Dixit, Girish ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER INTERCONNECTS; ELECTRON FLOW;

ACTIVATION ENERGY; COPPER; CURRENT DENSITY; DIFFUSION; ELECTRIC CONDUCTORS; ELECTROMIGRATION; INTERFACES (MATERIALS); MICROSTRUCTURE; NUCLEATION; REACTIVE ION ETCHING; SILICON NITRIDE; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRON TRANSITIONS;

EID: 0344946287     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1621727     Document Type: Article

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