SCOPUS 정보 검색 플랫폼

Electrochemical and Solid-State Letters

Volumn 2, Issue 10, 1999, Pages 534-536

Copper wafer bonding

(3) Fan, A a Rahman, A a Reif, R a,b

a MASSACHUSETTS INSTITUTE OF TECHNOLOGY (United States)

b ELECTROCHEMICAL SOCIETY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

POSTBONDING ANNEAL;

ANNEALING; BOND STRENGTH (MATERIALS); BONDING; COPPER; DIFFUSION IN SOLIDS; HYDROCHLORIC ACID; METALLIZING; NITROGEN; SCANNING ELECTRON MICROSCOPY; TANTALUM;

SILICON WAFERS;

EID: 0032594183 PISSN: 10990062 EISSN: None Source Type: Journal
DOI: 10.1149/1.1390894 Document Type: Article

Times cited : (207)

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