Wafer level electromigration applied to advanced copper/low-k dielectric process sequence integration

International Integrated Reliability Workshop Final Report

Volumn , Issue , 1998, Pages 10-15

  Pierce, Donald ^a   Educato, James ^a   Rana, Viren ^a   Yost, Dennis ^a  

^a Sandia Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CURRENT DENSITY; ELECTROMIGRATION; METALLIZING; RELIABILITY; SEMICONDUCTOR DEVICE TESTING; SILICA;

WAFER-LEVEL ELECTROMIGRATION;

MOS DEVICES;

EID: 0032316083     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)