Key reliability issues for copper integration in damascene architecture

Microelectronic Engineering

Volumn 55, Issue 1-4, 2001, Pages 245-255

  Gonella, R ^a  

^a STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; DEPOSITION; DIFFUSION; ELECTROMIGRATION; SILICON NITRIDE;

DAMASCENE;

DIELECTRIC FILMS;

EID: 0034831699     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00454-8     Document Type: Article

References (13)

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