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Volumn 308-309, Issue 1-4, 1997, Pages 443-447

Electromigration in 0.25 μm wide Cu line on W

Author keywords

Cu lines; Electromigration; Microstructure

Indexed keywords

ACTIVATION ENERGY; ANODES; CATHODES; CRYSTAL MICROSTRUCTURE; ELECTROMIGRATION; POLYCRYSTALLINE MATERIALS; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN;

EID: 0031245670     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)00487-2     Document Type: Article
Times cited : (72)

References (22)
  • 4
    • 0347417313 scopus 로고
    • For example, see special volume of Mater. Res. Soc. Bull., 19 (1994).
    • (1994) Mater. Res. Soc. Bull. , vol.19
  • 5
    • 0347417312 scopus 로고
    • Thin Solid Films, 262 (1-2) (1995).
    • (1995) Thin Solid Films , vol.262 , Issue.1-2
  • 20
    • 0002232676 scopus 로고
    • J.M. Blakly (ed.), Academic Press, NY, Ch. 6
    • H.P. Bonzel, in J.M. Blakly (ed.), Surface Physics of Materials, Vol. II, Academic Press, NY, 1975, Ch. 6.
    • (1975) Surface Physics of Materials , vol.2
    • Bonzel, H.P.1
  • 21
    • 0347417310 scopus 로고
    • J.J. Burke, N.L. Reed and V. Weiss (eds.), Syracuse University Press, NY, Ch. 11
    • N.A. Gjostein, in J.J. Burke, N.L. Reed and V. Weiss (eds.), Surfaces and Interfaces I, Syracuse University Press, NY, 1966, Ch. 11.
    • (1966) Surfaces and Interfaces , vol.1
    • Gjostein, N.A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.