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Volumn 308-309, Issue 1-4, 1997, Pages 443-447
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Electromigration in 0.25 μm wide Cu line on W
a a a a |
Author keywords
Cu lines; Electromigration; Microstructure
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Indexed keywords
ACTIVATION ENERGY;
ANODES;
CATHODES;
CRYSTAL MICROSTRUCTURE;
ELECTROMIGRATION;
POLYCRYSTALLINE MATERIALS;
TRANSMISSION ELECTRON MICROSCOPY;
TUNGSTEN;
EDGE DISPLACEMENT TECHNIQUE;
COPPER;
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EID: 0031245670
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/S0040-6090(97)00487-2 Document Type: Article |
Times cited : (72)
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References (22)
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