Effect of copper on the microstructure and electromigration lifetime of Ti-AlCu-Ti fine lines in the presence of tungsten diffusion barriers

Journal of Applied Physics

Volumn 80, Issue 9, 1996, Pages 4952-4959

  Domenicucci, A G ^a,c   Filippi, R G ^a   Choi, K W ^a,d   Hu, C K ^b   Rodbell, K P ^b  

^a IBM MICROELECTRONICS   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c Analytical Services Group

^d INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002440396     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.363539     Document Type: Article

References (20)

1. I. Ames, F. d'Heurle, and R. Horstmann, IBM J. Res. Dev. 14, 461 (1970).
2. K. P. Rodbell, P. W. DeHaven, and J. D. Mis, Mater. Res. Soc. Symp. Proc. 225, 91 (1991).
3. E. G. Colgan and K. P. Rodbell, J. Appl. Phys. 75, 3423 (1994).
4. B. D. Knowlton, R. I. Frank, and C. V. Thompson, Mater. Res. Soc. Symp. Proc. 391, 361 (1995).
5. C.-K. Hu, P. S. Ho, M. B. Small, and K. Kelleher, Mater. Res. Soc. Symp. Proc. 225, 99 (1991).
6. C.-K. Hu, M. B. Small, and P. S. Ho, J. Appl. Phys. 74, 969 (1993).
7. R. G. Filippi, H. S. Rathore, R. A. Wachnik, and D. Kruger, VMIC 1992, Proceedings of the 9th International VLSI Multilevel Interconnection Conference, Santa Clara, CA, June, p. 359.
8. B. N. Agarwala, B. Patnaik, and R. Schnitzel, J. Vac. Sci. Technol. 9, 283 (1972).
9. R. W. Bower, Appl. Phys. Lett. 23, 99 (1973).
10. E. G. Colgan, Mater. Sci. Rep. 5, 1 (1990).
11. S. Vaidya and A. K. Sinha, Thin Solid Films 75, 253 (1981).
12. D. B. Knorr, D. P. Tracy, and K. P. Rodbell, Appl. Phys. Lett. 53, 3241 (1991).
13. B. K. Chakraverty, J. Phys. Chem. Solids 28, 2401 (1967).
14. J. P. Hirth, J. Cryst. Growth 17, 63 (1972).
15. D. R. Frear, J. R. Michael, C. Kim, A. D. Romig, Jr., and J. W. Morris, Jr., Proc. SPIE 1596, 72 (1991).
16. Binary Alloy Phase Diagrams, 2nd ed., edited by T. B. Massalski (ASM International, Metals Park, OH, 1992), Vol. I, p. 142.
17. J. J. Estabil, H. S. Rathore, and E. N. Levine, VMIC 1991, Proceedings of the 8th International VLSI Multilevel Interconnection Conference, Santa Clara, CA, June, p. 242.
18. C. Kim and J. W. Morris, Jr., J. Appl. Phys. 73, 4885 (1993).
19. J. R. Black, Proc. IEEE 57, 1587 (1969).
20. C.-K. Hu, Thin Solid Films 260, 124 (1995).