Analysis of electromigration test data

2001 6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2001 - Proceedings

Volumn 2, Issue , 2001, Pages 964-966

  Tan, Cher Ming ^a   See, Woon Loon ^a   Kah Chin Tey, J ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84964474459     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSICT.2001.982055     Document Type: Conference Paper

References (8)

1. B.J. Root and T. Turner, "Wafer Level Electromigration Test for Production Monitoring," in Proceedings of the 23rd IEEE International Reliability Physics Symposium, (1985) p. 100.
2. R.E. Jones and L.D. Smith, "A New Wafer-Level Isothermal Joule Heated Electromigration Test for Rapid Testing of Integrated-Circuit Interconnect," J. Appl. Phys., Vol. 61, 4670 (1987).
3. E. Snyder, "SWORD: Sandia Wafer Level Reliability Software for HP4062UX Parametric Test System", Version 1.10, 1994 Hewlett-Packard (1994)
4. S. Foley, J. Molyneaux and A. Mathewson, "An evaluation of fast wafer level test methods for interconnect reliability control", Microelectronics Reliability, vol. 39, 1707 (1999)
5. Cher Ming Tan, Kelvin Ngan Chong Yeo, "A reliability statistics perspective on the potential pitfalls of standard wafer level electromigration accelerated test (SWEAT)", J. Electronic Testing, 17(1), 63 (2001)
6. Cher Ming Tan, "Development of Quantitative Fast Wafer Level Electromigration Test", NTU Technical Research Report (2001)
7. Guan Zhang, "Reliability Data Analysis Software Development in Semiconductor Industry", M.Eng Dissertation, School of EEE, NTU (2001)
8. J.R. Lloyd and R.H. Koch, "Electromigration-induced vacancy behavior in unpassivated thin films", J. Appl. Phys., 71(7), 3231 (1992)