Investigation of the effect of temperature and stress gradients on accelerated em test for Cu narrow interconnects

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 288-293

  Tan, Cher Ming ^a,b   Roy, Arijit ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NONE   (Singapore)

Author keywords

Electromigration; Electron wind force; Stress gradient; Temperature gradient

Indexed keywords

COPPER; DIFFUSION; ELECTROMIGRATION; FLUXES; MATHEMATICAL MODELS; STRESSES; THERMAL EFFECTS;

ELECTRON WIND FORCES; STRESS GRADIENTS; TEMPERATURE GRADIENT;

INTERCONNECTION NETWORKS;

EID: 33644906605     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.101     Document Type: Conference Paper

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