Physical failure analysis in semiconductor industry - Challenges of the copper interconnect process

Materials Science in Semiconductor Processing

Volumn 5, Issue 4-5 SPEC., 2002, Pages 457-464

  Zschech, Ehrenfried ^a   Langer, Eckhard ^a   Engelmann, Hans Juergen ^a   Dittmar, Kornelia ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

Defect analysis; Failure localization; Physical failure analysis; Process monitoring

Indexed keywords

COPPER; CRYSTAL DEFECTS; CRYSTAL MICROSTRUCTURE; FAILURE ANALYSIS; INTERCONNECTION NETWORKS; SCANNING ELECTRON MICROSCOPY; TOMOGRAPHY; TRANSMISSION ELECTRON MICROSCOPY;

INTERCONNECT PROCESSES; PHYSICAL FAILURE ANALYSIS;

SEMICONDUCTOR MATERIALS;

EID: 0036962353     PISSN: 13698001     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1369-8001(02)00124-5     Document Type: Conference Paper

References (13)

1. International Technology Roadmap for Semiconductors, Semiconductor International Association, 2001.
2. Diebold AC, Goodall RK. Proceedings of the International Interconnect Technology Conference IITC, San Francisco, 1999. p. 77.
3. Zschech E., Blum W., Zienert I., Besser P.R. Z Metallkd. 92:2001;803-809.
4. Engelmann H.J., Saage H., Zschech E. Microelectron Reliab. 40:2000;1747-1751.
5. Seiler H. J Appl Phys. 54:1983;R1-R18.
6. Nikawa K, Inoue S. Proceedings of the Asian Testing Symposium AST, Akita, 1997. p. 214-19.
7. Engelmann HJ, Zschech E. International Conference on Characterization and Metrology for ULSI Technology. AIP Conf Proc (Amer Inst Phys) 2000;550:491-9.
8. Zschech E., Engelmann H.J., Saage H., de Robillard Q., Stegmann H. Prakt Metallogr. 38:2001;442-453.
9. Mardinly J. Microscopic and Microanalysis Meeting, Long Beach 2001, unpublished.
10. Stegmann H, Engelmann HJ, Zschech E. Microelectron Eng 2002;65 (1-2).
11. Diebold A.C., McDonald R. Future Fab Int. 1:1997;323-330.
12. Stevie F.A., Vartuli C.B., Giannuzzi L.A., Shofner T.L., Brown S.R., Rossie B., Hillion F., Mills R.H., Antonell M., Irwin R.B., Purcell B.M. Surf Interf Anal. 31:2001;345-351.
13. Weiland R, Boit C, Dawes N, Dziesiaty A, Demm E, Ebersberger B, Frey L, Geyer S, Hirsch A, Lehrer C, Meis P, Kamolz M, Lezec H, Rettenmaier H, Tittes W, Treichler R, Zimmermann H. International Symposium for Testing and Failure Analysis (ISTFA), Bellevue Washington, 2000. p. 393-6.