Nondestructive void size determination in copper metallization under passivation

IEEE Transactions on Device and Materials Reliability

Volumn 3, Issue 3, 2003, Pages 69-78

  Gan, Zhenghao ^a   Tan, Cher Ming ^a   Zhang, Guan ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Electromigration; Electron beam heating; Finite element analysis; Metallization; Nondestructive technique; Void detection

Indexed keywords

ELECTRON-BEAM HEATING; METAL INTERCONNECTION; VOID DETECTION;

COMPUTER SIMULATION; COPPER; ELECTRIC POTENTIAL; ELECTROMIGRATION; ELECTRON BEAMS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; HEATING; NONDESTRUCTIVE EXAMINATION; PASSIVATION; ULSI CIRCUITS;

METALLIZING;

EID: 3042742800     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2003.815285     Document Type: Article

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