Electromigration and mechanical stress

Microelectronic Engineering

Volumn 49, Issue 1, 1999, Pages 51-64

  Lloyd, J R ^a  

^a Lloyd Technology Associates Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; THERMAL STRESS;

REFRACTORY UNDERLAYS;

MICROELECTRONICS;

EID: 0033225102     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00429-3     Document Type: Article

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