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Volumn 425, Issue 1-2, 2003, Pages 265-274

Effects of the high-pressure annealing process on the reflow phenomenon of copper interconnections for large scale integrated circuits

Author keywords

Copper interconnection; Creep; High pressure annealing; Large scale integration

Indexed keywords

ANNEALING; COPPER; FINITE ELEMENT METHOD; PHYSICAL VAPOR DEPOSITION; RESIDUAL STRESSES;

INTERCONNECTIONS;

INTEGRATED CIRCUITS;

EID: 0037415942 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(02)01120-3 Document Type: Article

Times cited : (18)

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