Properties of TaNx films as diffusion barriers in the thermally stable Cu/Si contact systems

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 14, Issue 2, 1996, Pages 674-678

  Takeyama, Mayumi ^a   Noya, Atsushi ^a   Sase, Touko ^a   Ohta, Akira ^a,b   Sasaki, Katsutaka ^a  

^a KITAMI INSTITUTE OF TECHNOLOGY   (Japan)

^b HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000962057     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.589155     Document Type: Article

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