Surface electromigration in copper interconnects

Microelectronics Reliability

Volumn 40, Issue 1, 2000, Pages 69-76

  McCusker, N B ^a   Gamble, H S ^a   Armstrong, B M ^a  

^a QUEEN'S UNIVERSITY BELFAST   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; CRYSTAL MICROSTRUCTURE; ELECTROMIGRATION; GRAIN BOUNDARIES; INTERCONNECTION NETWORKS; MAGNETRON SPUTTERING; MORPHOLOGY; SEMICONDUCTING FILMS; SEMICONDUCTOR DEVICE MODELS;

GRAIN BOUNDARY GROOVING MODELS;

ULSI CIRCUITS;

EID: 0033907970     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(99)00091-8     Document Type: Article

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