Copper interconnections and reliability

Materials Chemistry and Physics

Volumn 52, Issue 1, 1998, Pages 5-16

  Hu, C K ^a   Harper, J M E ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Copper interconnections; Copper polyimide; Damascene; Electromigration

Indexed keywords

COPPER; DIGITAL INTEGRATED CIRCUITS; ELECTROMIGRATION; INTERCONNECTION NETWORKS; POLYIMIDES;

CHIP INTERCONNECTIONS; COPPER INTERCONNECTIONS;

MICROPROCESSOR CHIPS;

EID: 0031695978     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(98)80000-X     Document Type: Review

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