Impact of intermetal dielectric process on Al via electromigration reliability

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 1999, Pages 60-63

  Liu, X ^a   Lo, K F ^a   Chin, K Y ^a   Guo, Q ^a   Teh, G L ^a  

^a Chartered Semiconductor   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONTACTS; ELECTRIC RESISTANCE; ELECTROMIGRATION; ETCHING;

INTERMETAL DIELECTRIC (IMD) PROCESS; STANDARD WAFER-LEVEL ELECTROMIGRATION ACCELERATED TEST (SWEAT);

SEMICONDUCTOR DEVICE TESTING;

EID: 0033284737     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ipfa.1999.791305     Document Type: Conference Paper

References (8)