Isothermal wafer-level electormigration test for the characterization of metal system reliability monitoring

International Symposium on VLSI Technology, Systems, and Applications, Proceedings

Volumn , Issue , 2001, Pages 275-278

  Kuo, C Y ^a   Yuan, H C ^a   Lee, S C ^a   Lee, S Y ^a   Chu, L H ^a   Shiue, R Y ^a   Yue, J T ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONNECTORS; ELECTROMIGRATION; METALLIZING; SEMICONDUCTOR DEVICE MANUFACTURE; STRESS ANALYSIS;

METAL INTERCONNECTION LINES; WAFER-LEVEL ELECTROMIGRATIONS;

WSI CIRCUITS;

EID: 0034848721     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)