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Volumn 45, Issue 3 A, 2006, Pages 1570-1574

Effect of plasma treatment and dielectric diffusion barrier on electromigration performance of copper damascene interconnects

Author keywords

Adhesion; Copper; Damascene interconnect; Dielectric diffusion barrier; Electromigration; Plasma treatment; Reliability

Indexed keywords

ADHESION; COPPER; DIFFUSION; ELECTROMIGRATION; OPTICAL INTERCONNECTS; RELIABILITY; SCANNING TUNNELING MICROSCOPY;

DAMASCENE INTERCONNECTS; DIELECTRIC DIFFUSION BARRIERS; PLASMA TREATMENT;

PLASMA APPLICATIONS;

EID: 33644903829 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.45.1570 Document Type: Article

Times cited : (26)

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