Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect

Microelectronics Reliability

Volumn 46, Issue 9-11, 2006, Pages 1652-1656

  Roy, Arijit ^a   Tan, Cher Ming ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; METALLIZING; STRESS ANALYSIS;

ATOMIC FLUX; ELECTROMIGRATION TEST; STRESS FREE TEMPERATURE; SUBMICRON INTERCONNECT;

ELECTROMIGRATION;

EID: 33748088166     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.036     Document Type: Article

References (12)

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