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Volumn 492, Issue 1-2, 2005, Pages 279-284

The influence of barrier types on the microstructure and electromigration characteristics of electroplated copper

Author keywords

Copper; Deposition process; Electromigration; Interfaces

Indexed keywords

ADHESIVES; COPPER; ELECTRIC RESISTANCE; ELECTROMIGRATION; ELECTROPLATING; INTERFACES (MATERIALS); MASS TRANSFER; MICROSTRUCTURE; TEXTURES; THERMAL CYCLING; THERMAL STRESS; THIN FILMS; WETTING;

EID: 25644443327     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.06.037     Document Type: Article
Times cited : (46)

References (23)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.