Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification

Journal of Applied Physics

Volumn 100, Issue 9, 2006, Pages

  Gu, M X ^a   Au Yeung, T C ^a   Tan, C M ^a   Nosik, V ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b STMICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; CONTINUUM MECHANICS; PHONONS; SILICON; SURFACE TREATMENT; THERMAL CONDUCTIVITY;

BOND ORDER LENGTH STRENGTH (BOLS) CORRELATION; NANOWIRES; PHONON DISPERSION;

NANOSTRUCTURED MATERIALS;

EID: 33751091481     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2364580     Document Type: Article

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