Effects of W-plug via arrangement on electromigration lifetime of wide line interconnects

Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998

Volumn 1998-June, Issue , 1998, Pages 116-118

  Skala, S ^a   Bothra, S ^a  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL ENGINEERING;

FIXED WIDTH; RESERVOIR AREA; VIA ARRAYS;

ELECTROMIGRATION;

EID: 34648871204     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1998.704767     Document Type: Conference Paper

References (5)

1. Instance, C. K. Hu, K. P. Rodbell. T. D. Sullivan, K. Y. Lee and D. P. Boulin, IBM J. Res. Develop, 39, 465 (1995).
2. B. Berg, Int. Rel. Phys. Symp. Proc. 35, 211 (1997
3. S. Skala, S. Bothra, D. Pramanik, S. Sengupta and S. H. A. Le, N. C. Tso and J. W. McPherson J. Electrochem M. Gall, D. Jawarani and H. Kawasaki, Mat. Res. SOC. Nariani, VMIC Proc. 14, 508 (1997).
4. SOC. 144, 2522 (1997).
5. Symp. proc. 428, 81 (1996).