Imaging of current paths and defects in Al and TiSi interconnects on very-large-scale integrated-circuit chips using near-field optical-probe stimulation and resulting resistance change

Applied Physics Letters

Volumn 74, Issue 7, 1999, Pages 1048-1050

  Nikawa, K ^a   Saiki, T ^b   Inoue, S ^c   Ohtsu, M ^b,d  

^a NEC CORPORATION   (Japan)

^b KANAGAWA ACADEMY OF SCIENCE AND TECHNOLOGY   (Japan)

^c TDI Co Ltd   (Japan)

^d TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0005336970     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.123451     Document Type: Article

References (14)

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