Atom motion of Cu and Co in Cu damascene lines with a CoWP cap

Applied Physics Letters

Volumn 84, Issue 24, 2004, Pages 4986-4988

  Hu, C K ^a   Gignac, L M ^a   Rosenberg, R ^a   Herbst, B ^a   Smith, S ^a   Rubino, J ^a   Canaperi, D ^a   Chen, S T ^b   Seo, S C ^b   Restaino, D ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER INTERCONNECTIONS; ELECTROMIGRATION DAMAGE; FOCUSED ION BEAMS (FIB); VOID FORMATION;

ACTIVATION ENERGY; ANNEALING; COBALT; CRYSTAL IMPURITIES; CRYSTAL MICROSTRUCTURE; DIFFUSION; ELECTRIC CONDUCTIVITY; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); ION BEAMS; SOLUBILITY; TRANSMISSION ELECTRON MICROSCOPY;

ELECTROMIGRATION;

EID: 3042856274     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1762991     Document Type: Article

References (12)

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